Wolfspeed, a specialist in silicon carbide technology, unveiled a silicon carbide module designed to transform the renewable energy, energy storage, and high-capacity fast-charging sectors through improved efficiency, durability, reliability, and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC Bus
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Shin-Etsu Chemical develops QSTTM substrate for 300-mm GaN
Shin-Etsu Chemical has created a 300-mm (12-inch) QSTTM substrate, which is a substrate dedicated to GaN epitaxial growth, and recently started supplying samples. Shin-Etsu Chemical has sold 150-mm (6-inch) and 200-mm (8-inch) QSTTM substrates and GaN on QSTTM epitaxial substrates of each diameter. Meanwhile, the company
JEDEC publishes essential test method to address switching energy loss in wide bandgap and silicon semiconductor power devices
JEDEC Solid State Technology Association announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices. Developed jointly by JEDEC’s JC-70.1 Gallium Nitride and JC-70.2 Silicon Carbide Subcommittees, JEP200 is available for free
Microvast and Minespider show battery passport demo at IAA Transportation 2024
Xendee and UIUC deliver phased approach to power data centers with renewables and advanced nuclear
Xendee, a specialist provider of the leading design and operation platform for distributed energy systems, partners with researchers from the Department of Nuclear, Plasma, and Radiological engineering (NPRE) at University of Illinois Urbana-Champaign (UIUC) to analyze and develop distributed energy solutions that
CyberPower launches PFC Sinewave 1U rackmount UPS systems
Cyber Power Systems, a specialist in power protection and power management products, launched PFC Sinewave UPS (uninterruptible power supply) systems in a rackmount 1U form factor, joining its best-selling product line for electronics requiring Active PFC (power factor correction) power source compatibility. Providing
Valens Semiconductor gets three automotive design wins from leading European OEMs for its VA7000 MIPI A-PHY chipsets
Discover the future of AC to DC Power Conversion
Pulsiv OSMIUM technology is an AC to DC front-end conversion method that applies intelligence to anactive valley fill approach and delivers a combination of game changing benefits in power electronicsdesigns: 99.5% peak front-end efficiency 97.5% average efficiency A unique flat efficiency profile Smaller and lower voltage
