Navitas’ latest SiCPAK power modules set new standard for unparalleled reliability & efficient high-temperature performance

Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, released its latest SiCPAK™ power modules with epoxy-resin potting technology, powered by proprietary trench-assisted planar SiC MOSFET technology, that

Vishay Intertechnology’s new TMBS rectifiers deliver high current ratings to 9A in DFN33A package

Vishay Intertechnology introduced 27 standard and Trench MOS Barrier Schottky (TMBS®) surface-mount rectifiers in the low profile DFN33A package with wettable flanks. Providing space-saving, high efficiency solutions for commercial, industrial, telecom, and automotive applications, the standard devices are the industry’s first in this package size and