Alpha and Omega Semiconductor introduced a new family of application-specific EZBuck™ regulators. The AOZ2263VQI-01 and AOZ2263VQI-02 are offered in a QFN 4 x 4 package and offer the industry’s most compact footprint to support VCCIO rails in Intel Rocket Lake platforms used
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TDK announces worldwide availability of the InvenSense ICP-10125 waterproof SmartPressure platform
II-VI expands silicon carbide manufacturing footprint for power electronics in EV and clean energy applications
II‐VI, a specialist in wide-bandgap compound semiconductors, has expanded its silicon carbide (SiC) wafer finishing manufacturing footprint in China to serve the largest worldwide market for electric vehicles (EVs) and for clean energy applications. Spurred by increasing regulatory requirements for lower emissions of
Semiconductor Energy Laboratory and Silvaco jointly develop SPICE model of oxide semiconductor FETs for AI applications
Semiconductor Energy Laboratory (SEL) and Silvaco have jointly developed a SPICE model of oxide semiconductor FETs (field effect transistor) for use in a variety of applications, including the AI (artificial intelligence) field. The crystalline oxide semiconductor CAAC-IGZOⓇ FET (c-axis aligned crystalline indium-gallium-zinc oxide
Crestron’s smart thermostat is powered by no batteries
MPINarada unveils 48VDC 200Ahr lithium battery for telecommunications and CATV networks
Axcelis continues to ship Purion M SiC implanter to European power chip manufacturers
Axcelis Technologies announced multiple follow-on shipments of the company's Purion M™ SiC medium current implanter to several leading power device chip makers located in Europe. The Purion M features Axcelis' innovative solution for high temperature silicon carbide processing. The systems, which shipped
