Quectel Wireless Solutions launched its latest high-performance MCU Zigbee and BLE module, the KCMA32S. This innovative module is designed to meet the growing demands of IoT applications, featuring advanced connectivity options and a compact form factor. Powered by Silicon Labs’ ultra-low-power EFR32MG21 wireless SoC,
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LG Energy Solution and First Phosphate push forward LFP supply chain in North America
Nexperia boosts wide-bandgap portfolio with 1200V SiC Schottky diodes for power-intense infrastructure
Nexperia added two 1200 V 20 A silicon carbide (SiC) Schottky diodes to its continuously expanding portfolio of power electronics components. The PSC20120J and PSC20120L have been designed to address the demand for ultra-low power loss rectifiers which enable high-efficiency energy conversion in industrial applications. As such they
JEDEC releases LPDDR6 standard to enhance mobile and AI memory performance
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD209-6, the latest Low Power Double Data Rate 6 (LPDDR6) standard. JESD209-6 is designed to significantly boost memory speed and efficiency for
Nexperia releases industry’s first ESD protection diodes for 48 V EV communications networks
Nexperia introduced the industry’s first ESD diodes designed to protect 48 V automotive data communications networks against the destructive effects of electrostatic discharge (ESD) events. This new portfolio of six robust AEC-Q101 qualified devices cover the required higher reverse working maximum voltage
Navitas plans 200mm GaN production with PSMC
Navitas Semiconductor announced a strategic partnership with Powerchip Semiconductor Manufacturing Corporation (PSMC or Powerchip), to start production and continue development of best-in-class 200mm GaN-on-silicon technology. Navitas' GaN IC portfolio is expected to use Powerchip’s 200mm in Fab 8B, located in Zhunan Science Park, Taiwan.
OKI and NTT Innovative Devices establish mass production technology for high-power terahertz devices by heterogeneous material bonding
OKI,in collaboration with NTT Innovative Devices has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics
Highstar unveils next-gen tabless cell series
Highstar launched its next-generation Tabless Cell series under the theme "Tabless Forest, Vitality Reborn". This release signifies a major structural and performance upgrade, directly addressing critical industry challenges and empowering global end-markets. It reflects Highstar's strategic response to future energy trends, drawing global
