Samtec (www.samtec.com), a specialist manufacturer of interconnect solutions, will showcase and demonstrate their latest high-performance interconnect and technologies at the PCI-SIG® Developers Conference 2019. Flexible Power MicroSamtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high-bandwidth optical, board-to-board and
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Richardson RFPD Announces Availability of Skived Fin Heat Sinks from Wakefield-Vette
Richardson RFPD (www.richardsonrfpd.com) announced the availability and full design support capabilities for a portfolio of skived fin heat sinks from Wakefield-Vette. These standard copper and aluminum skived fin heat sinks offer an alternative to extruded heat sinks for applications that require a thin
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PCIM Europe 2019, Yet another visitor record this year
Thermoelectric modules protect heat-sensitive CMOS sensors
SCHMID Group, Nusaned Investment and RIWAQ announce partnership focusing on manufacturing and technology development in the field of Vanadium Redox Flow Batteries (VRFB)
Broadcom drives gigabit broadband with industry’s highest port density processor
Broadcom (www.broadcom.com) announced the production release of the BCM65550, a G.fast 212 MHz system-level vector processor, enabling gigabit broadband services to be delivered to high-density residential areas. Telecom operators can now deploy fiber to these locations and leverage the existing installed copper