Skyworks Solutions (www.skyworksinc.com), an innovator of high performance analog semiconductors connecting people, places and things, launched a broad range of advanced, proprietary solutions optimized for next generation 5G wireless infrastructure applications. Skyworks 5G infrastructure Skyworks’ growing portfolio includes a family of market-leading high efficiency
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ShenDengen launches LLC current resonant mode controller IC
ShenDengen (www.shindengen.com) launched the MCZ5216ST LLC current resonant mode controller IC achieving higher efficiency and lower noise in 100-500W output class power supplies. The newly developed MCZ5216ST is an LLC current resonance control IC which combines the functionality of the previous MCZ5211ST with
videantis enjoys design wins of deep learning processor for mobile phones, drones and VR/AR
Videantis (www.videantis.com), a specialist supplier of computer vision and video coding semiconductor solutions, goes upbeat with its v-MP6000UDX visual processing architecture and v-CNNDesigner tool. The new processor increases deep learning algorithm performance by up to three orders of magnitude, while maintaining software
TriLumina releases world’s first ‘LED Killer’ device for mobile 3D sensing
TriLumina (www.trilumina.com), a specialist developer of flip-chip VCSEL(vertical-cavity surface-emitting laser) technology for 3D sensing, launched the world’s first surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, which allows for lower costs and higher performance than existing
TDK cooperates with Boréas on smart haptic solutions
TDK (www.tdk.com) announced that its subsidiary TDK Electronics has signed a cooperation agreement with Boréas Technologies (www.boreas.ca), a specialist developer of ultra-low-power haptic technologies, in order to accelerate the adoption of piezo haptic solutions in a broad range of applications. Under the agreement,
ElectroCraft’s MobilePower features powerful compact wheel drives
ElectroCraft (www.electrocraft.com), a specialistl fractional horsepower motor and motion solutions provider, has expanded their MobilePower™ traction system offer with the MPW52 and MPW86. The MobilePower™ Wheel-Drive (MPW) features a high torque-density brushless DC motor with an integrated single-stage planetary gearbox and wheel
TDK releases PowerHap evaluation kits for haptic feedback
Richardson RFPD announces new SCALE-iDriver SiC-MOSFET gate driver from Power Integrations
Richardson RFPD (www.richardsonrfpd.com) announced the availability and full design support capabilities for a new gate driver integrated circuit from Power Integrations, Inc. The SIC1182K SCALE-iDriver™ is a high-reliability, single-channel silicon carbide (SiC) MOSFET gate driver that delivers the industry-leading peak-output gate current without
TowerJazz expands its high voltage low RDSON power platform
TowerJazz (www.towerjazz.com) announced the release of its leading edge 140V low Rdson power platform, providing significant high power efficiency at high voltages. This advanced offering expands the Company’s 90V technology platform, specifically designed to address the increasing demand for cost-competitive, higher voltage integrated
Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019
Indium Corporation (www.indium.com) will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom. Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining