TriEye, a pioneer of the world's first cost-effective, mass-market Short-Wave Infrared (SWIR) sensing technology, released the TES200 1.3MP SWIR image sensor. Based on the innovative TriEye CMOS image sensor technology that allows SWIR capabilities using a CMOS manufacturing process, the TES200 is the first commercially available product released in the Raven
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AI driven gesture-sensing camera technology launches in the latest Ricoh Collaboration Board for meeting rooms
Post-Covid, there has been considerable advancement in integrating video conferencing into meeting spaces. However, users continue to seek more engaging and collaborative experiences, taking into account both on-site and remote participants, which go beyond video and audio calls afforded by current solutions. FlatFrog
WiGL and Energous bring touchless wireless power transfer networks to market
TVS array guards against damaging transients
Switching application guide for T&M engineers building data acquisition systems
A specialist manufacturer of high performance reed relays, Pickering Electronics has released the latest in its series of educational application guides for engineers building test & measurement (T&M) systems, titled: How Data Acquisition Benefits from Reed Relays. This subject matter expert-authored comprehensive application guide explains why reed
Wolfspeed unveils cutting-edge SiC module solution to boost clean energy capacity
Wolfspeed, a specialist in silicon carbide technology, unveiled a silicon carbide module designed to transform the renewable energy, energy storage, and high-capacity fast-charging sectors through improved efficiency, durability, reliability, and scalability. The 2300V baseplate-less silicon carbide power modules for 1500V DC Bus
Shin-Etsu Chemical develops QSTTM substrate for 300-mm GaN
Shin-Etsu Chemical has created a 300-mm (12-inch) QSTTM substrate, which is a substrate dedicated to GaN epitaxial growth, and recently started supplying samples. Shin-Etsu Chemical has sold 150-mm (6-inch) and 200-mm (8-inch) QSTTM substrates and GaN on QSTTM epitaxial substrates of each diameter. Meanwhile, the company
JEDEC publishes essential test method to address switching energy loss in wide bandgap and silicon semiconductor power devices
JEDEC Solid State Technology Association announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices. Developed jointly by JEDEC’s JC-70.1 Gallium Nitride and JC-70.2 Silicon Carbide Subcommittees, JEP200 is available for free
Microvast and Minespider show battery passport demo at IAA Transportation 2024
Xendee and UIUC deliver phased approach to power data centers with renewables and advanced nuclear
Xendee, a specialist provider of the leading design and operation platform for distributed energy systems, partners with researchers from the Department of Nuclear, Plasma, and Radiological engineering (NPRE) at University of Illinois Urbana-Champaign (UIUC) to analyze and develop distributed energy solutions that