[OFC 2022] Skorpios Technologies shows off single chip Tru-SiPh™ transmitter

Skorpios Technologies, a vertically integrated leader in heterogeneously integrated silicon photonics, is exhibiting at the Optical Fiber Conference (OFC) in San Diego March 8-10 in booth 5727. The company demonstrates its unique Tru-SiPh™ platform heterogeneously integrating lasers, modulators, and other components on a polarization insensitive silicon

CMOS molecular electronics chip for single-molecule biosensing

Roswell Biotechnologies, the molecular electronics company, announced that Chief Science Officer Barry Merriman, Ph.D. presented a paper titled "A CMOS Molecular Electronics Chip for Single-Molecule Biosensing" at the prestigious International Solid-State Circuits Conference (ISSCC) on Feb. 22. The presentation detailed the design of the Roswell Molecular Electronics (ME)

Xanadu collaborates with GlobalFoundries to accelerate development of fault-tolerant photonic quantum computers

Xanadu announced a collaboration with GlobalFoundries® (GF®) to take the first steps toward high-volume manufacturing of photonic chips for universal and fault-tolerant quantum computers. Taking advantage of the sophistication and rich feature set offered by GF Fotonix™, Xanadu is now designing integrated photonic devices,

LG Energy Solution obtains license from CAMX Power 's advanced cathode material platform for lithium-ion batteries 

LG Energy Solution has obtained a license under the intellectual property of CAMX Power relating to the GEMX® platform of nickel based high-energy, high-power cathode materials for use in lithium-ion batteries especially for electric vehicles (EVs). The GEMX platform is based on fundamental inventions of CAMX

EV Group and Teramount collaborate to implement innovative packaging technologies for photonic integrated circuits 

EV Group (EVG), a specialist supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, collaborates with Teramount, the leader in scalable solutions for connecting optical fibers to silicon chips, to implement wafer-level optics to solve a major