Nextchip, a world-leading provider of highly efficient automotive embedded platforms, and emotion3D, one of the global top automotive in-cabin analysis software vendors, teamed up to provide one of the market’s most efficient embedded platform and software packages for driver and occupant monitoring. Based
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Axcelis announces successful closure of Purion Dragon evaluation tool
Axcelis Technologies announced the successful closure of a Purion Dragon™ high current evaluation tool at a leading memory manufacturer. The Purion Dragon has a revolutionary high current implanter architecture, featuring innovative orthogonal beam optics, designed for advanced memory and logic applications. With the closure
Innoscience propels 8-inch GaN-on-Si FET business in USA and Europe
Innoscience Technology, the company founded to create a global energy ecosystem based on high performance, low-cost Gallium-Nitride-on-Silicon (GaN-on-Si) power solutions, announced the official launch of its international operations in the USA and Europe. Headquartered in Suzhou, China, Innoscience is now poised to support
EPC releases Phase 14 Report on GaN Reliability and use of physics-based models to project eGaN device lifetime
EPC announced its Phase-14 Reliability Report, documenting the strategy used to achieve a remarkable field reliability record. The rapid adoption of GaN devices in diverse applications calls for the continued accumulation of reliability statistics and research into the fundamental physics of failure in GaN
II-VI licenses single-crystal diamond technology from Element Six to enable disruptive applications in emerging markets
II‐VI and Element Six announced a strategic collaboration that will expand II-VI’s diamond platform, accelerating the development of new disruptive applications by licensing Element Six’s single-crystal diamond technology. In a world where size, weight, and power consumption are strategic value drivers, the unique characteristics of
[Design Focus] SENSORYCLOUD.AI: "Wake" word revalidation
[New] eFuse series for sub-power rails in server applications
Alpha and Omega Semiconductor (AOS) released its initial eFuse product for sub-power rails in server applications. The AOZ18101DI series are 5A eFuse in a compact 3mm x 3mm DFN package. The new products use AOS’s advanced co-packaging technology, combining a high-performance IC with protection features and
Keysight and Proventia collaborate to optimize EV battery test solutions
Keysight Technologies has collaborated with Proventia, a Finnish technology company that provides solutions in the engine, machine and vehicle industries to combat climate change, to improve electric vehicle (EV) battery test solutions. Automotive manufacturers, suppliers and test facilities need to increase the driving range of an
pSemi's 5G mmWave RF front-end s1olution for 5G wireless infrastructure covers 24 to 40GHz
pSemi®, a Murata company focused on semiconductor integration, expanded its millimeter wave (mmWave) RF front-end portfolio for 5G wireless infrastructure applications. The new pin-to-pin compatible products, including three beamforming ICs and two up-down converters, offer flexibility to interchange ICs for full IF-to-RF