Valens Semiconductor’s HDBaseT chipsets will form the connectivity infrastructure inside Barco’s ClickShare USB-C Extension over CAT kit. The product adds a wired extension connectivity option to Barco’s ClickShare Hub, delivering reliable and low-latency USB-C extension for complex videoconferencing installations. The ClickShare USB-C Extension over
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Knowles Specialty Components meet growing demand for pulse power in complex applications
Across aerospace and defense applications, industrial systems, and medical devices, modern technologies increasingly depend on precise, reliable, and repeatable power delivered in tightly controlled timeframes. These needs place a greater demand on the components, particularly capacitors, that store and release energy in
Navitas’ isolated through-hole package for SiC MOSFETs enable direct-cooled thermal management
Navitas Semiconductor launched its new UHV‑TO‑247‑4‑ISO package, setting a new benchmark for high‑performance discrete power devices. Featuring over 12 mm pin-to-pin creepage and greater than 6000 V integrated isolation, the package is purpose‑built for 1200 V to 3300 V GeneSiC SiC MOSFETs, delivering module‑like performance
[PCIM Europe 2026] onsemi unveils GaNEXUS GaN power portfolio
[electronica Shanghai 2026] Vicor showcases innovative 48V high performance power solutions for automotive, HPC and industrial
Vicor will showcase cutting-edge 48V high-performance power solutions at electronica Shanghai 2026. During the exhibition, Vicor will present its best-in-class power modules and 48V solutions addressing the pressing needs in automotive, HPC and industrial. With the rapid development of AI, electric mobility and
Mitsubishi Electric ships 5th-generation SiC-MOSFET bare die samples
[PCIM Europe 2026] GE Aerospace and Wolfspeed jointly accelerate high-voltage Silicon Carbide (SiC) adoption
GE Aerospace and Wolfspeed have entered into a Memorandum of Understanding (MOU) to collaborate on accelerating the adoption of high-voltage silicon carbide across the industrial, aerospace and defense markets. Under the MOU, the companies plan to develop standards for high-voltage silicon carbide power
