THREADS program propels temperature limitations of GaN RF chips

BAE Systems’ FAST Labs™ research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency’s (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program and has been awarded continued support to move into Phase

Ambiq’s ultra-low power SoCs feature scalable edge AI and platform enhancements for intelligent devices

Ambiq Micro unveiled Apollo330 Plus and Apollo510 Lite SoC series designed to help manufacturers bring high-performance, power-efficient edge AI devices to market faster, are now available.  The Apollo330 Plus and Apollo510 Lite series span six variants—Apollo330 Plus, Apollo330B Plus, Apollo330M Plus, Apollo510 Lite, Apollo510B Lite, and