Indium Corporation’s Kim Flanagan, Technical Support Engineer, will host a reliability webinar as part of Indium Corporation’s new webinar series on Webex at 11 a.m. April 28. Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry
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Indium Corporation to Feature Automotive Products at SMTconnect
Indium Corporation will feature its high-reliability solder paste and innovative alloy pairing, which provides enhanced performance in automotive applications, at SMTconnect, May 5-7, Nuremberg, Germany. Indium8.9HF Solder Paste is an industry-proven solder paste that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhance
Indium Corporation Expert Honored with IPC APEX Expo Special Recognition Award
Indium Corporation Experts to Present at IPC APEX Expo
Indium Corporation Expert to Present at IMAPS Autumn Conference 2019
Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the IMAPS Autumn Conference 2019, October 17-18, in Munich, Germany. Karch will present Flux Systems in Solder Pastes: The Demands on Electrical Reliability are Increasing. He will discuss how the advancing electricification of
Indium Corporation Expert to Present at SiP Conference China 2019
Indium Corporation’s Aaron Yan, Area Technical Manager, Semiconductor, will present at the SiP Conference China 2019, September 10-11, in Shenzhen, China. Yan’s presentation, Novel Water-Soluble Flux Study for Heterogeneous Integration Assembly, will detail a high-viscosity, high-tack flux designed to be used to secure components at
Indium Corporation to Host Reliability Symposium at SMTA Atlanta
Indium Corporation Experts to Present at IMAPS Boston
Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston, Massachusetts. Dr. Ning-Cheng Lee, Vice President of Technology, will lead a professional development course, Achieving High-Reliability for Lead-Free Solder Joints –
Indium Corporation Launches New Indium Oxide
Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019
Indium Corporation (www.indium.com) will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN), July 8-10, Oxford, United Kingdom. Indium Corporation’s high-temperature AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining