반도체 및 첨단 웨이퍼 레벨 패키징(WLP) 애플리케이션을 위한 웨이퍼 처리 솔루션 전문 기업인 ACM 리서치가 팬아웃형 패널 레벨 패키징(FOPLP) 애플리케이션에 적합한 Ultra C vac-p 진공 세정 장비를 출시했다. ACM 리서치의 Ultra C vac-p 패널 레벨 첨단 패키징 진공 세정 장비이 장비는 진공 기술을 이용해
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
상하이 일렉트릭, 수소 에너지망 개발 가속화로 청정에너지 보급 촉진
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