EPC Space unveiled the EPC7C021, a high-performance, three-phase motor demonstration board featuring the radiation-hardened EPC7011L7C eGaN® IC. Designed for ease of evaluation and system integration, the EPC7C021 delivers a user friendly, flexible platform for developing motor drive applications such as reaction and momentum wheels, ion thrusters, robotics
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Toshiba un veils automotive photorelay with 1800V output withstand voltage
Toshiba Electronic Devices & Storage has launched an automotive photorelay, “TLX9165T,” in a 10pin SO16L-T package, that supports high voltage automotive batteries with an output withstand voltage of 1800V (min). Volume shipments start today. Improved charge times and longer cruising ranges are essential
넥스페리아의 차량 및 전기차용 ESD 보호 IC 공급은 누가?
마우저 일렉트로닉스(Mouser Electronics)가 넥스페리아(Nexperia)의 최신 정전기 방전(electro-static discharge, ESD) 보호 IC인 PESD1ETH10L-Q 및 PESD1ETH10LS-Q를 공급한다. ESD 보호 기능을 가진 이 제품들은 오픈 얼라이언스의 IEEE 10BASE-T1S, 100BASE-T1, 1000BASE-T1 표준을 완벽하게 준수해 10BASE-T1S 차량용 이더넷 애플리케이션에 적합하다. 이 제품들은 IEC 61000-4-2 규정에 따라 최대 18kV의 ESD 보호 성능을 제공하고 15kV에서 1000회의
Nexperia brings benefits of clip-bonded FlatPower packaging to bipolar junction transistors
Nexperia announced the expansion of its bipolar junction transistor (BJTs) portfolio by introducing 12 new MJD-style BJTs in clip-bonded FlatPower (CFP15B) packaging. This new offering released as MJPE-series addresses the ongoing industry demand for more power-efficient and cost-effective designs in both industrial and automotive
로옴, 업계 최소 회로전류를 실현한 초소형 CMOS OP Amp 개발해
Diodes’ 64GT/s PAM4 linear ReDriver features enhanced signal quality for PCIe 6.0 interface speeds
Diodes unveiled the industry’s first ReDriver™ to reach PCI Express® (PCIe®) 6.0 protocol speeds (up to 64 GT/s) while being backwards-compatible with PCIe 5.0/4.0/3.0 protocols. The PI3EQX64904 is a low-power, high-performance, 64GT/s, four-differential-channel, PAM4, linear ReDriver. Target applications include AI data centers
주문 처리 간소화 위한 통합 소프트웨어 제품군
Smiths Interconnect launches ‘DaVinci Gen V’ next-generation test socket
Smiths Interconnect, a specialist provider of innovative solutions for critical semiconductor test applications, launched DaVinci Gen V, the latest test socket in its DaVinci series portfolio. The product rigorously tests semiconductor chips during the manufacturing process to ensure they provide unwavering reliability and
