Schaffner, the international leader in the fields of electromagnetic compatibility and power quality, markets the FN3840 for use in Active Infeed Converter (AIC) or Active Front End (AFE) applications where energy is fed back to the power grid. This process reduces energy costs
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Melexis reveals compact, low-voltage 3D magnetometer for consumer applications
Melexis, a global microelectronics engineering company, is targeting white goods, consumer electronics, and smart-metering applications with the MLX90392 three-axis magnetic field sensor, which can operate from a 1.8 V power rail shared with other components such as logic devices. Requiring no dedicated LDO
[Hot] XP Power’s regulated high-voltage DC-DC converters for analytical, semiconductor and detector applications
Nordic’s first PMIC features Li-ion/Li-Po battery charger and DC/DC buck regulator
Zyter’s IoT solution features 360-degree view of the factory with analytics to improve productivity and safety
Zyter, a specialist digital health and IoT-enablement platform, launched Zyter Smart Factories™, an end-to-end intelligent solution that connects factory floor machinery, workers, and building systems using the latest Internet of Things (IoT) technology devices on Zyter’s digital transformation platform. Zyter Smart Factories is
Jeeva unveils world’s lowest power wireless chip
GaN Systems expands automotive product line
GaN Systems, the global leader in GaN power semiconductors, announced the expansion of its family of automotive-grade 650V transistors. The GS-065-060-5-B-A is a 60A, bottom-side cooled transistor developed for demanding high-power electric vehicle applications such as onboard chargers, traction inverters, and DC-DC
RS Components extends features of DesignSpark PCB PRO
Reno Sub-Systems launches integrated RF power systems for semiconductor manufacturing at 7nm or below
Reno Sub-Systems (Reno), a developer of high performance radio frequency (RF) matching networks for leading-edge nanoscale semiconductor manufacturing, introduced its new GenMatch™ Series that integrates the company’s proven solid-state Electronic Variable Capacitor (EVC™) RF match and Precis™ generator technologies into a single
