Semtech markets bidirectional Tri-Edge CDR IC solution GN2256 is a with integrated differential EML driver for 50Gbps SFP56 PAM4 5G wireless optical modules Semtech announced sampling of the newest member of its Tri-Edge™ CDR portfolio, the GN2256. Integrating Semtech’s proven Tri-Edge CDR platform
Author: Hordon Kim
TDK announces worldwide availability of the InvenSense ICP-10125 waterproof SmartPressure platform
II-VI expands silicon carbide manufacturing footprint for power electronics in EV and clean energy applications
II‐VI, a specialist in wide-bandgap compound semiconductors, has expanded its silicon carbide (SiC) wafer finishing manufacturing footprint in China to serve the largest worldwide market for electric vehicles (EVs) and for clean energy applications. Spurred by increasing regulatory requirements for lower emissions of
GHz 대역폭에 더욱 접근이 용이한 SµRF 마이크로파 RF 솔루션 나왔다
에이디링크, 새로운 EtherCAT 모듈 출시로 산업 자동화를 위한 EtherCAT 솔루션을 완성해
Semiconductor Energy Laboratory and Silvaco jointly develop SPICE model of oxide semiconductor FETs for AI applications
Semiconductor Energy Laboratory (SEL) and Silvaco have jointly developed a SPICE model of oxide semiconductor FETs (field effect transistor) for use in a variety of applications, including the AI (artificial intelligence) field. The crystalline oxide semiconductor CAAC-IGZOⓇ FET (c-axis aligned crystalline indium-gallium-zinc oxide
Crestron’s smart thermostat is powered by no batteries
MPINarada unveils 48VDC 200Ahr lithium battery for telecommunications and CATV networks
Axcelis continues to ship Purion M SiC implanter to European power chip manufacturers
Axcelis Technologies announced multiple follow-on shipments of the company's Purion M™ SiC medium current implanter to several leading power device chip makers located in Europe. The Purion M features Axcelis' innovative solution for high temperature silicon carbide processing. The systems, which shipped