DSP Group and Alango Technologies announced the availability of Alango’s Extended Voice Communication Package (eVCP) on DSP Group’s DBMD7 SmartVoice processor. The combination allows providers of high-performance voice conferencing systems to quickly develop solutions for a rapidly evolving unified communications market that
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Qualcomm and Capgemini jointly boost 5G private network implementations for industries
Qualcomm Technologies and Capgemini, have announced their plan to collaborate to unlock the benefits of 5G private networks to support their clients’ digital transformation towards Intelligent Industry. This collaboration is intended to give clients access to an off-the-shelf private network system which is
[Hot] Optical amplifiers from Lumentum
The proliferation of 100G in backbone and metro networks is placing ever-greater demands on optical amplifiers to deliver a requisite optical signal to noise ratio (OSNR) to support high bit rate transmission. Lumentum offers the most comprehensive portfolio of high-performance amplifiers (Raman, high
[Design Focus] Upgrade vision systems with AI capabilities
Pleora’s AI Gateway is an off-the-shelf embedded solution that lets designers easily deploy artificial intelligence and machine learning skills in existing vision applications to reduce costly inspection errors, false-positives and secondary screenings. In a retrofit application, the AI Gateway acts as an intermediary
X-FAB introduces analog/mixed-signal reference design kit for Siemens’ Tanner IC design tools
Arteris’ IP FlexNoC interconnect is again licensed by AutoChips for automotive SoC product line
Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, announced that Chinese automotive semiconductor vendor AutoChips has again licensed FlexNoC interconnect IP for use in automotive
OmniVision unveils industry’s first 8 megapixel medical-grade image sensors for single-use and reusable endoscopes
OmniVision Technologies announced its next-generation OH08A and OH08B CMOS image sensors―the first 8 megapixel (MP) resolution sensors for single-use and reusable endoscopes. Additionally, the new OH08B is the first medical-grade image sensor to use OmniVision’s award-winning Nyxel® near-infrared (NIR) technology―bringing revolutionary imaging
Valens collaborates with leading sensor vendor to evaluate A-PHY integration in next-generation products
Valens, the semiconductor company that is pushing the boundaries of connectivity, has started an evaluation with Sony Semiconductor Solutions Corporation (Sony) to develop and integrate MIPI A-PHY technology into next-generation image sensor products. A-PHY is a long-reach serializer-deserializer (SerDes) physical layer interface for
MaxLinear linearization and Cree GaN on SiC power amplifiers combine to efficiently power new ultra-wideband 5G
MaxLinear and Cree announced breakthrough performance when combining MaxLinear’s ultra-wideband linearization solution (MaxLin) and Cree’s Wolfspeed® Gallium Nitride (GaN) on SiC mid-band power amplifiers. The new solution increases wireless capacity of a 5G base station, supporting more simultaneous users and increasing the
Quanergy announces new strategic collaboration with Sensata Technologies
Quanergy and Sensata Technologies signed up a new strategic collaboration to focus on helping Quanergy bring affordable, smart LiDAR and 3D perception technologies to market. The collaboration will include Sensata providing insights to Quanergy on manufacturability, cost reduction, sourcing and go-to-market strategies. “Sensata