Trixell has adopted its TCAD-based parasitic extraction flow for the development of their next-generation displays to ensure that manufacturing specifications are met. Imaging display technology uses an array of thin-film transistors (TFTs) that require the application of ultrathin layers of semiconductor and insulator
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Diode’s USB type-C linear mux/demux ReDriver with integrated USB-C detector restores signal integrity, reducing latency
Diodes unveiled the PI3EQX10612/PI3EQX10312 2-port 10Gbps linear ReDriver™ devices with integrated USB-C® detection for equipment implementing a USB Type-C®interface. Offering 1:2/2:1 mux/demux functionality, the ReDrivers can be used to extend the reach of USB signals running across rigid or flexible PCBs in
Perceive’s edge interference processor deliver data center-class accuracy and performance at ultra-low power for consumer devices
Testing GaN devices to failure demonstrates robustness unmatched by silicon power MOSFETs, EPC says
Testing GaN devices to failure demonstrates robustness unmatched by silicon power MOSFETs, EPC says Efficient Power Conversion (EPC) announced its Phase Eleven Reliability Report, documenting the strategy used to achieve a remarkable field reliability record. This strategy relied upon tests forcing devices to
EPC’s ePower stage IC features higher performance and smaller solution size for high power density applications
래디시스, 세계 첫 AI 동영상 봇 인게이지 비디오 어시스턴트 공개
Maxim unveils industry’s first ASIL-grade car camera power protector
BrainChip and Socionext jointly provide new low-power artificial intelligence platform for AI edge applications
BrainChip, a specialist provider of ultra-low power high performance AI technology, announced that Socionext will offer customers an Artificial Intelligence Platform that includes the Akida SoC, an ultra-low power high performance AI technology. BrainChip has developed an advanced neural networking processor that brings
CyberLink integrates FaceMe facial recognition to Altek AI BOX
[White paper] Practical considerations when comparing SiC and GaN in power applications
Practical considerations when comparing SiC and GaN in power applications By Anup Bhalla, PhD. VP Engineering UnitedSiC Abstract Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductor technologies are promising great things for the future. SiC devices in a cascode configuration enable existing systems