HP and Sisvel have concluded an agreement for the Palo Alto-based global technology leader to become a licensee of the Sisvel Wi-Fi 6 patent pool. The deal follows a mediation process ordered by Judge Rodney Gilstrap, of the US District Court for the
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Imec’s 300mm GaN program features advanced power devices to reduce manufacturing costs
imec, welcomed AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications. This program track, part of imec’s industrial affiliation program (IIAP) on GaN power electronics,
DELO and DATRON drive industrialization of fuel‑cell sealing applications with joint system solution
OKI selects Sequans’s platform for zero-energy IoT series to monitor critical infrastructure
Sequans Communications, a specialist provider of 4G/5G IoT semiconductor solutions, announced that Japanese IT company Oki Electric Industry had selected Sequans' Monarch® LTE-M/NB-IoT platform to power its innovative Zero-Energy IoT Series for monitoring critical infrastructure and disaster sites. The Zero-Energy IoT Series is
Morse Micro mass procudes MM8108 Wi-Fi HaLow SoC, modules, evaluation kit and HaLowLink 2
Morse Micro, a specialist of Wi-Fi HaLow silicon solutions, today announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC). This milestone represents a major leap-forward for Wi-Fi HaLow, bringing unparalleled data throughput at range, which will enable the next generation
PI details 1250V and 1700V PowiGaN technology for next-generation 800VDC AI data centers
Eaton unveils next-generation architecture to advance 800 VDC power infrastructure for AI factories
Intelligent power management company Eaton announced the delivery of a new reference architecture designed to accelerate the adoption of 800 VDC power in artificial intelligence (AI) data centers. Eaton’s new design, built in support of the 800 VDC architecture announced by NVIDIA, leverages Eaton’s
Altair and Gordon Murray Group develop groundbreaking ultra lightweight platform for vehicle
Altair, a specialist in computational intelligence, collaborates with Gordon Murray Group (GMG) as part of an Advanced Propulsion Centre UK (APC) facilitated project, M-LightEn. This project will utilize Altair’s leading optimization solutions and concept development processes to support the next generation ultra
“Made-in-India” smart chip powers future digital identities
L&T Semiconductor Technologies LTSCT), Centre for Development of Advanced Computing (C-DAC), and Indian Institute of Technology Gandhinagar (IIT Gandhinagar) have signed a Tripartite Agreement to collaborate on the research, development, and commercialisation of secure integrated circuit (IC) solutions for critical applications, with
Quectel’s four new GNSS antennas maximize developer choice
Quectel Wireless Solutions has introduced four new additions to its comprehensive range of global navigation satellite system (GNSS) antennas. The new antennas include the YFGD000AA high precision, low profile antenna which covers all GNSS bands, the YFGD000BA, optimized for triple-band solutions in GNSS L1, L2