Efficient Power Conversion (EPC) will showcase the company’s newest generation GaN technology at PCIM Asia 2026, taking place August 26–28 in Shenzhen, China (Hall 16, Booth B03). At the show, EPC will demonstrate how its Gen7 GaN platform enables compact, high-performance power
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Power-Thermal Synergy: The Evolution of Integrated Cooling Infrastructure
Author: Eric You, LITEON Advanced Mechanical Infrastructure As next-generation AI accelerators boost thermal design power (TDP) from H100-class 700W envelopes to 1000W and beyond, the existing airflow paradigm becomes a bottleneck. Yet, rack-scale hot-spot management gets tougher. Peak computing may be limited by thermal
Intrinsic Power accelerates commercialization of AI power infrastructure for data centers
Intrinsic Power, a developer of AI-enabled electrical infrastructure, announced the first close of its Seed financing, bringing together a syndicate of strategic investors with deep expertise across industrial technology, energy infrastructure, and digital infrastructure. The financing from Kyocera Ventures, Drive Catalyst, Boost VC, and RPV Global will
Dynex unveils advanced pulse power semiconductor solutions for high-energy switching applications
Qnity’s thermal management solutions beat heats of AI and high-power electronics
Qnity Electronics, a specialist technology solutions leader across the semiconductor value chain, launched two new thermal interface materials (TIM): Laird™ Tflex™ CR910, a two-part dispensable liquid gap filler, and Tgrease™ 3000 thermal grease, both designed to help customers address increasingly complex thermal
Pure Lithium appoints Mercedes-Benz battery veteran as CPO
EMASS collaborates with Bosch Sensortec to deliver edge AI ssset tracking solution
EMASS, a specialist in ultra efficient edge AI semiconductor technology, goes hand in hand with Bosch Sensortec to develop an intelligent asset-tracking reference design that combines advanced sensing with ultra-low-power edge AI. The jointly developed platform enables battery powered asset trackers to
Navitas and Magnachip get together to accelerate high-voltage and ultra-high-voltage SiC adoption
Navitas Semiconductor and Magnachip Semiconductor go hand in hand to accelerate adoption of SiC technologies in high-voltage (HV) and ultra-high-voltage (UHV) power markets. Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC™ Trench-Assisted PlanarTM (TAP) technology to enter the HV and
EVE Energy strengthens European operations through compliance, local manufacturing, and regional services
ITEN develops breakthrough solid-state batteries for next-generation implantable medical devices
ITEN, a specialist of solid-state energy storage solutions with exceptional power and energy densities, announced a major development program to adapt its high-capacity solid-state battery technology for Class III implantable medical devices. Through SOLIMED, ITEN’s development project within the European IPCEI Tech4Cure