Renesas Electronics launched the industry's first 650V GaN device with dual-side cooling for high-density power conversion in 800V high-voltage DC (HVDC) AI data center architectures. The new TP65H020G4PLSGBD D-Mode device delivers 20 milliohms (mΩ) on-resistance — one of the lowest in its
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The strategic case for hybrid AC/DC power
Wise Integration and Navitas work together for performance computing applications
Wise Integration goes hand in hand with Navitas Semiconductor to collaborate on advancing power-computing applications for AI PCs, high-end workstations, desktop computers for gamers and industrial systems. The companies will focus on AI Data Center power supply units (PSUs) and exploration of additional
Aptiv begins ADAS smart camera production
NoMIS Power demonstrates 6.5KV SiC MOSFET, advancing high-voltage roadmap to 10KV and 20 KV SiC IGBTs
NoMIS Power demonstrated the 6.5KV SiC MOSFETs successfully last month. While the company’s MOSFET portfolio scales from 3.3KV (in production) through the demonstrated 6.5KV device, the highest voltage classes – 10KV and above – increasingly favor SiC insulated-gate bipolar transistor (IGBT) architectures
[SISPAD 2026] Atomera highlights advances in GaN devices
Toradex unveils SoM powered by Qualcomm Dragonwing for demanding industrial Edge AI
Toradex, a specialist in embedded computing solutions, unveiled the Aquila IQ8 - its first System on Module built on Qualcomm Dragonwing industrial-grade processors. Powered by the Qualcomm Dragonwing™ IQ-8275 processor from Qualcomm Technologies, Inc., the Aquila IQ8 brings high-end, power-efficient compute to the
Qnity unveils CMP slurry platform for advanced packaging
Qnity Electronics has further expanded its offerings for advanced packaging with the introduction of the Stackplane™ family of slurries for chemical mechanical planarization (CMP). Stackplane™ slurries support the industry's move toward shrink and stack, where continued transistor scaling is paired with the stacking
Molex new EBO connector solves space, thermal and maintenance challenges in AI and hyperscale networks
Molex unveiled the VersaBeam Mini, an ultra-compact, 16-fiber Expanded Beam Optical (EBO) connector that solves critical space, thermal and maintenance challenges in high-density AI and hyperscale networks. Building on the award-winning Molex VersaBeam EBO interconnect family, VersaBeam Mini combines expanded beam performance
Diodes’ field-plated Super Barrier Rectifier® devices feature industry-leading efficiency and reliability in automotive systems
Diodes unveiled a new family of automotive-compliant* field-plated Super Barrier Rectifier (SBRFP) products that include the 2A SBRFP2M60P1Q and SBRFP2M60SAFQ, 3A SBRFP3M60SAFQ, and 8A SBRFP8A60P5Q. Serving as drop-in replacements for comparable Schottky and PN junction diodes, the SBRFP devices feature industry-leading ultra-low