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In modern industrial manufacturing, adhesive bonding processes are becoming increasingly important as a flexible and material-friendly alternative to conventional joining methods. However, these processes often face a conflict between efficiency and environmental compatibility. Plasmatreat GmbH addresses this issue by offering innovative applications

Microchip Technology announced a demonstration showcasing an end‑to‑end PCIe® Gen 6 storage architecture, combining Microchip’s Switchtec™ PCIe Gen 6 switches with high-performance Micron 9650 NVMe® solid state drives (SSDs). The demonstration highlights the role of next‑generation PCIe technology in enabling higher data throughput, reduced latency and scalable connectivity

Future Electronics is highlighting Nexperia’s commitment to engineering excellence, manufacturing integrity, and long-term operational resilience through a featured content campaign focused on building confidence throughout the electronics design lifecycle. In today’s rapidly evolving electronics industry, engineers require more than high-performance components. They need

Author: Eric You, LITEON Advanced Mechanical Infrastructure As next-generation AI accelerators boost thermal design power (TDP) from H100-class 700W envelopes to 1000W and beyond, the existing airflow paradigm becomes a bottleneck. Yet, rack-scale hot-spot management gets tougher. Peak computing may be limited by thermal

For decades, pulse power technology has enabled some of the world's most demanding scientific, medical and industrial systems. From fusion energy research and particle accelerators to pulsed X-ray equipment and advanced manufacturing, these applications all rely on the ability to release enormous