Baidu AI Cloud launched an AI sign language platform able to generate digital avatars for sign language translation and live interpretation within minutes. Released as a new offering of Baidu AI Cloud's digital avatar platform XiLing, this platform aims to help break down
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[OFC 2022] Skorpios Technologies shows off single chip Tru-SiPh™ transmitter
Skorpios Technologies, a vertically integrated leader in heterogeneously integrated silicon photonics, is exhibiting at the Optical Fiber Conference (OFC) in San Diego March 8-10 in booth 5727. The company demonstrates its unique Tru-SiPh™ platform heterogeneously integrating lasers, modulators, and other components on a polarization insensitive silicon
CMOS molecular electronics chip for single-molecule biosensing
Roswell Biotechnologies, the molecular electronics company, announced that Chief Science Officer Barry Merriman, Ph.D. presented a paper titled "A CMOS Molecular Electronics Chip for Single-Molecule Biosensing" at the prestigious International Solid-State Circuits Conference (ISSCC) on Feb. 22. The presentation detailed the design of the Roswell Molecular Electronics (ME)
Xanadu collaborates with GlobalFoundries to accelerate development of fault-tolerant photonic quantum computers
Xanadu announced a collaboration with GlobalFoundries® (GF®) to take the first steps toward high-volume manufacturing of photonic chips for universal and fault-tolerant quantum computers. Taking advantage of the sophistication and rich feature set offered by GF Fotonix™, Xanadu is now designing integrated photonic devices,
LG Energy Solution obtains license from CAMX Power 's advanced cathode material platform for lithium-ion batteries
LG Energy Solution has obtained a license under the intellectual property of CAMX Power relating to the GEMX® platform of nickel based high-energy, high-power cathode materials for use in lithium-ion batteries especially for electric vehicles (EVs). The GEMX platform is based on fundamental inventions of CAMX
Teledyne e2v HiRel unveils 650 V, 60 A GaN HEMTs for for hi-rel applications
EV Group and Teramount collaborate to implement innovative packaging technologies for photonic integrated circuits
SiPearl uses Ansys Power Signoff solution to develop high-performance, low-power microprocessors
Ansys has been selected by SiPearl to enable the development of its world-class high performance computing (HPC) microprocessor family as part of the European Processor Initiative (EPI) consortium for exascale supercomputing. SiPearl will leverage the best-in-class Ansys RedHawk-SC™ multiphysics simulation platform to validate semiconductor power integrity, minimize power consumption,