Dynex Semiconductor has announced the development of a new 450A, 650V Gallium Nitride (GaN) half-bridge power module, designed to deliver ultra-fast switching performance, high efficiency, and enhanced thermal management for demanding power conversion applications. As industries seek to improve energy efficiency, reduce system
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우크라이나 전력 공급 유지 지원하는 AI 에너지 플랫폼
코보, 소형 X-밴드 프론트엔드 모듈로 차세대 레이더 설계 과제 해결
로옴, 업계 최고 수준 저손실의 650V 내압 IGBT 개발
서울대 반도체공동연구소, 차세대반도체패키지연구센터 설립
ST’s compact direct Time-of-Flight 3D LiDAR module brings high-resolution spatial awareness to compact edge AI systems
STMicroelectronics launched the VL53L9, a compact direct Time-of-Flight 3D LiDAR all-in-one module that sets a new benchmark in high-resolution sensing. The VL53L9 combines state-of-the-art features in a compact and cost-effective package, delivering AI-ready output data for low-compute edge AI systems on small
