본드 패드 금속화는 전력 소자, 자동차 전장, 그리고 첨단 반도체 패키징에서 반도체 다이와 인터커넥트 간의 중요한 인터페이스 역할을 한다. 업계가 더 높은 전력 밀도, 더 미세한 피치 설계, 그리고 더 엄격한 신뢰성 요건을 추구함에 따라 최적화된 본드 패드 소재에 대한 수요가 커지는
[PCIM Europe 2025] SemiQ, 최신 SiC 기술 선보여
LITEON, 서버에 CoolMOS 8 MOSFET 채택해
Nexperia launches industry leading automotive-qualified 1200 V silicon carbide MOSFETs in D2PAK-7 packaging
Nexperia announced a range of highly efficient and robust automotive qualified silicon carbide (SiC) MOSFETs with RDS(on) values of 30, 40 and 60 mΩ. These devices (NSF030120D7A0-Q, NSF040120D7A1-Q, NSF060120D7A0-Q), which deliver industry-leading figures-of-merit (FoM), were previously offered in industrial grade and have
Nexperia offers automotive planar Schottky diodes in space-saving CFP2-HP packaging
Nexperia is offering a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging. The portfolio includes eight industrial (e.g. PMEG6010EXD), as well as eight AEC-Q101 qualified (e.g. PMEG4010EXD-Q) products. This release supports the growing trend for manufacturers to replace devices in SMA/B/C type
[PCIM Europe 2025] EPC showcases state-of-the-art GaN products
EPC is exhibiting its latest advancements in high-performance GaN technology at PCIM Europe 2025, taking place 6–8 May in Nuremberg, Germany. The copany showcases a wide array of GaN-based power solutions powering next-generation applications—from high-density computing to motor drives for humanoid robots, automotive
