지능형 전력 및 센싱 기술의 선도기업인 온세미(onsemi)는 자사의 RSL15 무선 마이크로컨트롤러(MCU)가 업계 최저 전력 소비량을 제공한다고 밝혔다. 블루투스 저에너지 무선 연결을 지원하는 RSL15는 전력 소비량 감소 없이 보안을 위해 연결되는 산업용 애플리케이션의 수요를 충족시킬 전망이다. RSL15는 임베디드 마이크로프로세서 벤치마크 컨소시엄(EEMBC)의 인증을 통해 에너지
로데슈바르즈 신호소스 분석기, 미 공군 연구소서 채택
로데슈바르즈(Rohde & Schwarz)는 자사의 신호소스 분석기(SSA: Signal Source Analyzer)가 미국 AFMETCAL(Air Force Metrology and Calibration Authority)에 채택되었다고 밝혔다. 이 제품들은 AFMETCAL의 정밀 측정 장비 연구소(PMEL: Precision Measurement Equipment Laboratories)와 공군 기초 표준 연구소(AFPSL: Air Force Primary Standards Laboratory)에서 운용될 예정이다. 신호소스 분석기는 Phase
[New] Transphorm’s evaluation board with Microchip’s DSP technology
Transphorm's TDTTP2500B066B-KIT is a 2.5 kW AC-to-DC bridgeless totem pole power factor correction (PFC) evaluation board. It pairs Transphorm’s SuperGaN® FETs with Microchip’s dsPIC33CK digital signal controller (DSC) board, which includes pre-programmed firmware that can be easily customized per end application requirements.
Tritium collaborates with fast charging network operator to deploy over 500 new EV fast chargers
Tritium, a specialist in direct current (DC) electric vehicle fast charging, has joined forces with EVCS, one of the largest fast charging networks on the West Coast, to expand electric vehicle (EV) charging solutions in California, Oregon, and Washington. EVCS, one of the
Boréas and Cirque launch first piezo haptic trackpad module for Windows 11 PC laptops and notebooks
Boréas Technologies, a pioneer in ultra-low-power high definition (HD) piezo haptic semiconductors, and Cirque, a global leader in touch-interface technologies, unveiled GlideSense™ with Boréas’ Piezo Haptic Trackpad technology, the first trackpad module that helps PC manufacturers meet rising demand for richer, more
[신제품] 고온에서 2W 출력하는 표면 장착형 DC/DC 컨버터
CyberOptics delivers technical presentation about importance of 3D inspection for advanced packaging at SEMICON Taiwan
CyberOptics, a specialist global developer and manufacturer of high-precision 3D sensing technology solutions, will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec 1-3rd. The company will also exhibit WaferSense® and ReticleSense® sensors and feature the
Sensata Technologies completes acquisition of SmartWitness
Sensata Technologies has completed the previously announced acquisition of leading video telematics provider SmartWitness. SmartWitness offers connected video telematics hardware, software, analytics, and support, including interfaces with more than 40 TSPs globally. Since 2017, SmartWitness has shipped more than 250,000 connected devices to
Soitec and Mersen jointly develop new silicon carbide (SiC) substrates for electric vehicle market
Soitec, a specialist in the design and production of innovative semiconductor materials, and Mersen, a global expert in electrical specialties and advanced materials, have entered into a strategic technical partnership to develop a new family of polycrystalline silicon carbide (poly-SiC) substrates for the
Qorvo acquires UnitedSiC, a specialist provider of silicon carbide power semiconductors
Early this month, Qorvo acquired Princeton, New Jersey-based United Silicon Carbide (UnitedSiC), a leading manufacturer of silicon carbide (SiC) power semiconductors. The acquisition of United Silicon Carbide expands Qorvo’s reach into the fast-growing markets for electric vehicles (EVs), industrial power, circuit protection,