QP Technologies™ (formerly Quik-Pak), a specialist provider of innovative microelectronic packaging and assembly solutions, has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. The fully automated bonders allow QP Technologies to provide more advanced wedge bonding
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
Cree | Wolfspeed continues to supply 150mm silicon carbide wafers to ST
Cree, a specialist in silicon carbide technology through its Wolfspeed® business, and STMicroelectronics expanded an existing multi-year, long-term silicon carbide wafer supply agreement. The amended agreement, which calls for Cree to supply ST with 150mm silicon carbide bare and epitaxial wafers over
KeepTruckin’s AI Dashcam features industry-leading accuracy to proactively prevent accidents, increase safety and efficiency
BrainChip receives Akida chips from Socionext America
BrainChip, a specialist provider of ultra-low power high performance artificial intelligence technology, has received the first batch of Akida™ chips from its manufacturing run from Socionext America (SNA). The chips were manufactured at Taiwan Semiconductor Manufacturing Company (TSMC) from a production mask set
