Power management and video/audio interface leader, Kinetic Technologies, is expanding its PoE power solutions portfolio with the introduction of KTA1136, a single-chip, highly integrated solution for 13W Power over Ethernet (PoE) Powered Devices (PD) significantly improving performance, while reducing both solution cost
Author: Hordon Kim
맥심, 설계 간소화·배터리 수명 연장하는 트라이나믹 MOSFET 게이트 드라이버 출시
[New] World’s smallest flexible antennas powering global communication
Crowd Supply sells QuickLogic’s SoC in USB port
WiBotic unveils chargers and transmitters for drones and autonomous mobile robots
WiBotic, a apseicalist in advanced charging and power optimization solutions for the rapidly expanding ecosystem of aerial, mobile, marine, space and industrial robots, introduced several new cutting-edge chargers and transmitters for drones and autonomous mobile robots. The products showcase WiBotic’s expertise in
Pasternack’s mechanically tunable waveguide Gunn diode oscillators support X, K and Ka bands
Pasternack comes out with a new line of waveguide Gunn diode oscillators ideal for electronic warfare, electronic countermeasures, microwave radio systems, military and commercial communications systems and more. The mechanically tunable waveguide Gunn diode oscillators cover WR-90, WR-42 and WR-28 waveguide sizes and
Xanadu and imec partner to develop photonic chips for fault tolerant quantum computing
Crocus Technology’s industry-fastest and most accurate TMR current sensor features no performance compromises
QP Technologies installs wire bonders, broadening reach in mil-aero, RF and power markets
QP Technologies™ (formerly Quik-Pak), a specialist provider of innovative microelectronic packaging and assembly solutions, has installed two new Hesse Mechatronics ultrasonic wire bonders at its wholly owned 20,000-square-foot facility. The fully automated bonders allow QP Technologies to provide more advanced wedge bonding
Cree | Wolfspeed continues to supply 150mm silicon carbide wafers to ST
Cree, a specialist in silicon carbide technology through its Wolfspeed® business, and STMicroelectronics expanded an existing multi-year, long-term silicon carbide wafer supply agreement. The amended agreement, which calls for Cree to supply ST with 150mm silicon carbide bare and epitaxial wafers over