Alchip Technology rolls out high-performance computing packaging capability

Alchip Technologies, a specialist in high-performance computing ASIC, rolled out its Chip-on-Wafer-on-Substrate (CoWoS®) packaging capability. CoWoS packaging, developed first by TSMC, is critical to successful deployment of today's High-Performance Computing (HPC) ASICs. CoWoS is a 2.5D wafer-level multi-chip packaging technology first introduced by

Indium Corporation Expert to Present at SEMICON China

Indium Corporation’s Sze Pei Lim, Regional Product Manager, will present on soldering material technology for heterogeneous integration at SEMICON China, June 26-29 in Shanghai. The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements