Perceive, an edge inference solutions company, launched the first product, the Ergo TM edge inference processor. Ergo brings breakthrough accuracy and performance to consumer devices such as security cameras, smart appliances, and mobile phones. The Ergo chip and reference board are currently
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InventHelp Inventor develops wind-powered generator for electric cars
Indium Corporation Expert to Participate in Low-Temperature Solders Debate
Huntkey unveils USB-C charger to support fast charging
Huntkey, a leading provider of power solutions, has recently introduced its new model of USB-C charger that features a US plug and a USB-C port to support fast charging. The Huntkey USB-C Charger: https://en.huntkey.com/product/30w-usb-c-port/ The charger can deliver 5V3A, 9V3A, 12V2.5A or 15V2A power outputs
Lumen Group receives UL’s first wireless electric vehicle charging certification
Alchip Technology rolls out high-performance computing packaging capability
Alchip Technologies, a specialist in high-performance computing ASIC, rolled out its Chip-on-Wafer-on-Substrate (CoWoS®) packaging capability. CoWoS packaging, developed first by TSMC, is critical to successful deployment of today's High-Performance Computing (HPC) ASICs. CoWoS is a 2.5D wafer-level multi-chip packaging technology first introduced by
Indium Corporation Robotic Soldering Expert to Host Webinar
Nexperia’s ultra-tiny MOSFET are 36% smaller with lowest RDS(on)
WiSA issues certification of Platin’s Milan 5.1 Wireless Home Theater speaker system
Indium Corporation Expert to Present at SEMICON China
Indium Corporation’s Sze Pei Lim, Regional Product Manager, will present on soldering material technology for heterogeneous integration at SEMICON China, June 26-29 in Shanghai. The development of heterogeneous integration, which packs more dies or components into a smaller footprint, requires multiple technological advancements