The Connectivity Standards Alliance announced the release of Matter 1.1. The release is a result of the collective effort of thousands of individuals who have gathered as Alliance members and contributed to this evolving technology's ongoing progress and success, offering an improved path
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Coherent and Mitsubishi collaborate to scale manufacturing of SiC power electronics on 200mm technology platform
SigmaSense partners with NXP Semiconductors to meet the heightened demands of future sensing systems
SigmaSense announced a license and co-development with NXP® Semiconductors to lead in the transition from traditional touch interfaces to multi-dimensional sensing capable of revolutionizing user experiences. SigmaSense has licensed technology to NXP, and the companies will collaborate on high-performance sensing products for specific applications with demands for faster, more robust, fully immersive software-defined experiences. “The next generation of smart devices and applications are
Sequans unveils world’s first chipset optimized for 5G broadband IoT devices
Sequans Communications, a specialist in 5G/4G cellular IoT chips and modules, unveiled Taurus 5G NR, the world’s first chipset platform specifically optimized for 5G broadband IoT devices, providing cost-effective support for applications including fixed wireless access, portable hotspots, mobile computing, video surveillance,
[New] Simulation model of industry’s first 1200 V GaN-on-Sapphire device
Transphorm's 1200 V FET simulation model and preliminary datasheet was embedded to the TP120H070WS FET, the only 1200 V GaN-on-Sapphire power semiconductor introduced to date. Transphorm supports future automotive power systems as well as three-phase power systems typically used in the broad industrial, datacom,
Luminar expands Asian businesses
Luminar (www.luminartech.com) partners with TPK, a multi-billion dollar supplier to companies like Apple and Tesla, to build and operate an additional high-volume factory driven by rapidly growing demand for Luminar in Asia. This follows Luminar’s April 13 announcement regarding the successful bring-up
Infineon’s CoolSiC™ XHP™ 2 high-power modules enable energy-efficient electrified trains to promote decarbonization
Infineon's CoolSiC™ XHP™ 2 high-power module To meet global climate targets, transportation must shift to more environmentally friendly vehicles such as energy-efficient electrified trains. Trains, however, have demanding operating profiles with frequent acceleration and braking, while being expected to operate reliably over a
Bosch acquires TSI Semiconductors to respond to growing demand for SiC chips for EVs
Plans to invest 1.5 billion USD in strategically important semiconductor business for electromobility Third pillar for semiconductor business: following Reutlingen and Dresden in Germany, Bosch will in the future also make chips in Roseville, California. Bosch is expanding its semiconductor business with silicon carbide
Seequent’s stability analysis tool helps engineers design safer slopes
Seequent, The Bentley Subsurface Company, released the SLOPE3D, an advanced slope stability analysis tool that empowers geotechnical engineers and engineering geologists to design safer slopes. Building on the capabilities of GeoStudio’s trusted 2D SLOPE/W product, SLOPE3D is an intuitive limit equilibrium solution for
LitePoint 5G test solutions for 5G small cell chipsets support validation of Qualcomm FSM 5G RAN platform
LitePoint announced that its 5G test solutions have received full validation from Qualcomm Technologies, Inc. in the Qualcomm® Development Acceleration Resource Toolkit (QDART) for calibrating and verifying products that incorporate the Qualcomm® FSM™100 5G RAN Platform, addressing Sub 6GHz and mmWave small cell