Morse Micro, a specialist of Wi-Fi HaLow silicon solutions, today announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC). This milestone represents a major leap-forward for Wi-Fi HaLow, bringing unparalleled data throughput at range, which will enable the next generation
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PI details 1250V and 1700V PowiGaN technology for next-generation 800VDC AI data centers
Eaton unveils next-generation architecture to advance 800 VDC power infrastructure for AI factories
Intelligent power management company Eaton announced the delivery of a new reference architecture designed to accelerate the adoption of 800 VDC power in artificial intelligence (AI) data centers. Eaton’s new design, built in support of the 800 VDC architecture announced by NVIDIA, leverages Eaton’s
Altair and Gordon Murray Group develop groundbreaking ultra lightweight platform for vehicle
Altair, a specialist in computational intelligence, collaborates with Gordon Murray Group (GMG) as part of an Advanced Propulsion Centre UK (APC) facilitated project, M-LightEn. This project will utilize Altair’s leading optimization solutions and concept development processes to support the next generation ultra
“Made-in-India” smart chip powers future digital identities
L&T Semiconductor Technologies LTSCT), Centre for Development of Advanced Computing (C-DAC), and Indian Institute of Technology Gandhinagar (IIT Gandhinagar) have signed a Tripartite Agreement to collaborate on the research, development, and commercialisation of secure integrated circuit (IC) solutions for critical applications, with
Quectel’s four new GNSS antennas maximize developer choice
Quectel Wireless Solutions has introduced four new additions to its comprehensive range of global navigation satellite system (GNSS) antennas. The new antennas include the YFGD000AA high precision, low profile antenna which covers all GNSS bands, the YFGD000BA, optimized for triple-band solutions in GNSS L1, L2
Quectel’s LTE modules enable 100-percent global reach for IoT developers
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, announced that several of its LTE modules are now available with Direct-to-Cell (D2C) functionality, enabling devices to seamlessly connect to satellite networks. By integrating D2C technology at the module level, Quectel enables devices to
Toshiba automotive photorelay achieves output withstand voltage of 1500V for automotive battery systems
Toshiba Electronic Devices & Storage has launched an automotive photorelay, “TLX9161T,” in a small SO12L-T package, that achieves an output withstand voltage of 1500V (min), the level required to support high voltage automotive batteries. Volume shipments start today. Key challenges in popularizing electric
[Contribution] Matching signal and power connectors to robotic and other high-density industrial applications
Written by Art Pini, DigiKey Smart factories are becoming increasingly automated through decentralized intelligence and control, utilizing modular robotic machine concepts. This physical distribution of control functions necessitates connectivity via wires and cables that ensure reliable and secure connectors matched with the environmental
Amogy and GreenHarvest target first ammonia-to-power deployment in Taiwan to accelerate industrial decarbonization
Amogy, a specialist provider of scalable and efficient ammonia-to-power solutions, announced a landmark partnership with GreenHarvest, a Taiwan-based renewable energy firm, to deploy the first-ever ammonia-to-power system in Taiwan. This strategic collaboration marks a significant milestone in Asia’s clean energy transition, bringing Amogy’s