Qualcomm unveils comprehensive data center roadmap for the agentic AI era

Qualcomm Technologies announced at its Investor Day, new data center solutions, including the Qualcomm Dragonfly™ C1000 CPU, Qualcomm® High Bandwidth Compute (HBC), Qualcomm Dragonfly™ AI300 inference accelerator, and connectivity products, together with custom silicon solutions, all engineered to maximize performance per watt and token throughput

Not all high density reed relays perform the same…

In high-density test systems, space matters. Engineers are often trying to fit more channels into smaller PCB areas, while still maintaining signal integrity, measurement accuracy and long-term reliability. This is where compact reed relays, such as Pickering’s 3.9 mm Series 120, can offer significant