MulticoreWare joins forces with Melexis for an AI algorithm development. They developed face understanding algorithm modules such as face detection, face recognition, drowsiness/distraction detection and anti-spoofing detection by use of a Melexis EVK75027 ToF sensor. MulticoreWare enhanced the internal data annotation tool
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Weebit Nano joins Global Semiconductor Alliance
Weebit Nano, a specialist developer of next-generation memory technologies for the global semiconductor industry, has joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry. GSA brings together the expanding ecosystem encompassing semiconductors, software, solutions, systems and services, and
Airgain launches high-performance 5G antenna platform
Himax unveils industry-first 288Hz 8K TV timing controller solution
II-VI signs major renewable energy contract in China
QuantumScape and Fluence collaborate on stationary storage with solid-state lithium-metal technology
QuantumScape and Fluence Energy announced a multi-year agreement to introduce solid-state lithium-metal battery technology to stationary energy storage applications. The strategic relationship brings together two companies leading in technology innovation focused on accelerating clean energy adoption and reducing global carbon emissions. The companies
[Tech Watch] World’s first stacked CMOS image sensor from Sony
Sony Semiconductor Solutions comes out with the world’s first stacked CMOS image sensor technology with 2-Layer Transistor Pixel. Whereas conventional CMOS image sensors’ photodiodes and pixel transistors occupy the same substrate, Sony’s new technology separates photodiodes and pixel transistors on different substrate
A*STAR and Soitec jointly develop next-generation SiC semiconductors
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec have announced a research collaboration to develop next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles and advanced high-voltage electronic devices. Under the collaboration, the parties
