EMASS has received the first engineering samples of its next-generation 16nm ECS-DoT edge AI SoC from TSMC. The design that was signed off in December 2025 and taped out in January 2026 has now been manufactured on TSMC’s 16nm FinFET process and
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
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