II‐VI has expanded its silicon carbide (SiC) wafer finishing manufacturing footprint in China to serve the largest worldwide market for electric vehicles (EVs) and for clean energy applications. Spurred by increasing regulatory requirements for lower emissions of greenhouse gases and the decreasing cost
Author: Hordon Kim
Hordon Kim is an international editor at Power Electronics Magazine. He covers global news and events in English and runs a consulting agency in Korea.
BrainChip begins volume production of Akida AI processor
BrainChip, a specialist of ultra-low power, high-performance AI technology, has begun volume manufacturing of its Akida™ AKD1000 neuromorphic processor chip for edge AI devices. The engineering layout for BrainChip’s high-performance, ultra-low power chip was designed in partnership with Socionext, a global developer of
Flux Power launches next-generation M24 lithium-ion battery pack for end riders & center riders
Flux Power, a developer of advanced lithium-ion industrial batteries for commercial and industrial equipment, announced the launch of the next generation M24 lithium-ion battery pack. “Soft’ power-off function ensures a smooth power transition for the equipment Hinged top cover for easier service accessibility
E Ink and DATA MODUL jointly expand color ePaper display applications
Webee’s no-code, turnkey IIoT platform for connected manufacturing drives projects from POC to production 10X faster
[Tech Watch] Tensor Streaming Processor (TSP) architecture capable of 1 PetaOp/s performance on a single chip implementation
BISTel inks enterprise agreement with leading RF semiconductor manufacturer
BISTel, the world leader in Engineering Equipment Systems (EES) and manufacturing AI software applications for smart manufacturing, announced a company-wide, multi-product, multi-site enterprise agreement with a leading provider of radio-frequency semiconductor devices which help connect a myriad of electronics systems serving military,
Ansys’ multiphysics platform enable H3C Semiconductor engineers to speed simulation analysis time by 10x and greatly improve product reliability
H3C Semiconductor leveraged Ansys simulation solutions to launch ENGIANT 660, a highly sophisticated network processor chip that enables routing, AI, 5G backhaul and cybersecurity applications. H3C Semiconductor designers used Ansys' cutting-edge multiphysics simulation platform to enhance product signoff efficiency, spur product development
